Colloidal Alumina suspension is a high-performance acidic solution designed for the final polishing of metallographic specimens and precision materials. With a controlled particle size of approximately 0.1 µm and a solid content of 20-25%, this suspension delivers exceptional surface quality through chemical-mechanical polishing (CMP). Specifically formulated for demanding materials such as nickel-based alloys, high-alloy steels, copper, and titanium, Colloidal Alumina aids in the formation and removal of a thin reactive surface layer. This process results in a scratch-free and deformation-free finish ideal for microscopic analysis and quality assurance.

**Additional fees are incurred for Temperature-controlled products.